Find another scholarly article related to the IDT problem and research question you identified in the last assignment. Complete a review (aka "annotation") of the scholarly source you found, organized as follows:

1. Give the source reference in APA citation style

2. In your own words, state the following, in essay form:

a) SUMMARIZE: What is the author's/researcher’s purpose for conducting this research/inquiry?

b) What research methods were used? Are they experimental, quantitative, qualitative, mixed?

c) If applicable, describe the subjects of the research and what happened. Were the subjects participants/interviewees, systems, observed events, review of other studies, or something else? Were they subjected to experimental treatment or were they observed, surveyed or trained and tested, etc.?

d) What were the findings and conclusions? What evidence and results are presented?

e) ANALYZE: What is remarkable about this study? What questions do you have about this study?

f) SYNTHESIZE: How does this article contribute to your understanding of your topic and HOW DOES IS IT HELP TO ANSWER YOUR MAIN QUESTION? Indicate clearly WHY this source is useful for your inquiry.

h) QUOTES: Are there one or two specific quotations that are useful or which are central to answering your main research question? Quote it (them) and remember to enclose them in quotes and note the page number. Also, remember to cite page numbers for any information that you have summarized or paraphrased.

can you talk it from

ntegrated Device Technology (IDT) Problem

A

summary

The primary purpose of the research was to identify various defects associated with the

Integrated Circuit (IC) using problem

–

solving tools. The study further suggests that the primary

concern of the IC packaging industry is defects since they can

occur at any stage of production. It

is worthwhile noting that Integrated Device Technology (IDT) is a company under the

semiconductor and IC industry. Therefore, a feasible solution will result after identifying the root

of the defects. The article utili

zed simple visual tools like stratification and Ishikawa diagram.

Also, the journal employs a Pareto analysis, which is a statistical tool. Ultimately, the authors

carried out experiments using the Taguchi design. These tools indicate that the researchers

used

both quantitative and qualitative approaches to analyze the results. It is essential to understand

that the results showed the highest number of defects in 6SC70M, 6SOT23M, and 5SC70M IC

packages.

Lastly, P

areto analysis indicated that molding was the

chief cause of the errors in AC.

For instance, it contributes 62.96 and 57.14 percent of 6SOT23M and 5SC70M respectively.

Analysis

The notable aspect of the entire research is how authors strive to increase the reliability of

their results. For instance,

after the identification of the defective packages, still, the author

s

employs stratification to confirm the results. Furthermore, the research narrow down to the

actual cause of the defects in the AC. Ultimately, the use of graphs and tables enable the

a

udience to understand the relationship between the variables; therefore, it will be easy to

conclude. However, Apart from the tools, what are other techniques or methods that can be used

to identify AC defects?

Synthesis

IDT PROBLEM

3

It is significant to understand that my topic was about challenges that semiconductors

companies encountered during manufacturing. Therefore, it was essential to focus on IDT since

it is an example of Semiconductor Company. The article was beneficial becau

se it provides a

coherent analysis of various problems that are common in all corporations dealing with products

such as attenuators, switches, and IC. Furthermore,

I

have not only under

stood the challenges

facing IDT

but also tools used to identify them.

Quotes

It is worth to note that the central question was about the challenges facing

semiconductors companies. A

uthors, address this question when they stated that, "Using the

Pareto analysis, it was also observed that molding is the process that contribut

es most to the

defects of the three types of packages which cover 62.96% of 6SOT23M, 57.14% of 5SC70M

and 73.91% of 6SC70M

(Abidin, K. A. Z., Lee, K. C., Ibrahim, I., & Zainudin, A, 2011, p.

1941)

.” Thus, I was able to i

dentify the exact problem that is rampant in semiconductors